Elpida Memory, Inc.
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Mid-Term Environmental Targets

FY2006 environmental targets and results and FY2007 targets

Evaluation: good = target achieved; fair = target 80% achieved; poor = target less than 80% achieved
Category Environmental objective Item FY2006 environmental target FY2006 results Evaluation FY2007 target
Eco-products Development of eco-products 8 products 8 products good 11 products
Development of smaller packages 3 products 3 products good 2 products
Reduction in hazardous substances 3 products 3 products good 3 products
Eco-factories Measures to combat global warming CO2 emissions (absolute amount) Front-end processes 397kt → 424kt *1 441.3kt fair *2 Front-end processes 521kt
Back-end processes
17kt Back-end processes 20kt
CO2 emissions
(wafer input units)
(compared with 2003)
61% 59.6% good Front-end processes
65%
CO2 emissions
(production volume units)
(compared with 2006)
0.121 t CO2/M Back-end processes 95%
PFC gas emissions
(absolute amount)
325 GWPkt → 336 GWPkt *1 357.6 GWPkt fair *3 285GWPkt
Indirect CO2 emissions
(wafer input units)
72% 65% good Shift to LCA
Effective resource use Use of gas and chemicals
(wafer input units)
85% 81.5% good 80%
Water purchased
(wafer input units)
69% 70.1% fair 69%
Resource recycling Waste emissions
(wafer input units)
95% 95.2% good 92%
Reuse of packing containers Proportion of wafer containers reused 75% 63% fair *4 Wafer containers 65%
Tray shipped 56%
Continual EMS improvement Establishment of ISO 14001-compliant EMS EMS integration ISO 14001-certified sites added
November 2006
December 2006 good Integration of Akita Elpida Memory into Group EMS

*1: Target reviewed owing to change in production plan.
*2: CGS operating rate reduced owing to the effect of increased price of city gas.
*3: PFC recovery measures suspended.
*4: Reuse rate lower for products produced overseas in comparison with Japan.

Mid-term environmental strategies

The Elpida Memory Group is working to establish Elpida Memory as an environmental brand by creating eco-products that benefit the environment, ensuring that its factories are ecologically friendly, and raising environmental awareness, based on the following mid-term strategies:

  • benefiting the environment by creating eco-products with higher device integration and functionality, and less energy consumption;
  • increasing numbers of chip per unit wafer by shrinking the design rule, thus boosting productivity (manufacturing energy consumed per product);
  • increasing the efficiency of manufacturing processes and reducing the energy and resources used per unit wafer or unit production, to attain the goal of ecofactories that exceed industry standards;
  • reducing greenhouse gases by introducing new materials and manufacturing technologies;
  • reducing waste through the adoption of new wasteprocessing technologies;
  • implementing measures to spread environmental awareness among employees, their families, and local communities; and
  • establishing the image of Elpida Memory as an environmental brand.
Environmental objective Parameter Results for reference year FY2007 target FY2010 target
Measures to
combat
global
warning
CO2
emissions
(units)
Front-end processes
(wafer input units)
100%
(2nd half of FY2003)
65% 72%
Back-end processes
(production units)
100%
(FY2006)
95% 91%
CO2
emissions *1
(absolute amount)
Front-end processes 224kt
(2nd half of FY2003)
521kt (592kt) *2
Back-end processes 17kt
(FY2006)
20kt 54kt
PFC gas emissions
(absolute amount)
224GWPkt
(2nd half of FY2003/yearly conversion)
285GWPkt 200GWPkt
Effective
resource
use
Use of gas and chemicals (wafer input units) 100%
(2nd half of FY2003)
80% 83%
Water purchased
(wafer input units)
100%
(2nd half of FY2003)
69% 67%
Waste emissions 100%
(2nd half of FY2003)
92% 98%
Prevention of
ozone layer
destruction
Elimination of halon gas fire extinguishers Promotion of plan for complete elimination in FY2008 Completely eliminated by FY2008

*1: The conversion factor for CO2 emissions of purchased power supply is based on the conversion factor used by power suppliers in a reference year.
*2: If it is assumed that wafer input to the 300-mm line will be 100,000 wafers/month in 2010 and the 200-mm line will be decommissioned, the amount produced will change accordingly.

Graph: CO2 emissions, CO2 emissions per wafer input unit

* Increasing the memory capacity per unit area of wafer and reducing CO2 emissions per wafer mean that CO2 emissions in total bit units will decrease by half by 2010 compared with 2006.

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