The Elpida Group consists of Elpida and 15 consolidated subsidiaries, which work together to develop, design, manufacture and sell DRAM products.
Elpida Memory, Inc.
Elpida oversees all group operations (business management, finance, general affairs, legal, marketing, production control, etc.). It also has charge of DRAM product development & design, wafer processing, sales to domestic customers and the supply of products to its overseas sales subsidiaries.
Listed below are various domestic and overseas business locations that handle development, design, manufacture and sales activities.
Development Bases
Development Center
The Development Center, Elpida's core research and development center, handles fundamental technology research, DRAM product circuit/layout design and its evaluation and analysis, product development and other activities.
Hiroshima Development Center
The Hiroshima Development Center is responsible for the development of manufacturing processes. This center is located on the site of the Hiroshima Plant.
Kansai Design Center
The Kansai Design Center designs DRAM chips.
Tohoku Design Center
The Tohoku Design Center designs DRAM chips. This center is located on the site of Akita Elpida Memory, Inc.
Munich Design Center
A center for developing graphics DRAMs (GDDR).
Rexchip Technology Development Office
Developing 40nm process technology using next-generation 4F2 memory cell configurations. The Technology Development Office is located on the site of the Rexchip fab facilities.
Milan Design Center
A center for developing new memory.
Production Bases: Front-End Process
Hiroshima Plant
The Hiroshima Plant is the core manufacturing facility in charge of wafer processing. This plant focuses mainly on the front-end manufacture of Premier DRAM. As of March 2010 the plant has a monthly production capacity of 130,000 wafers.
Affiliate Company
Rexchip Electronics Corporation
Elpida's Taiwan subsidiary Rexchip focuses on the front-end manufacture of DRAMs for PCs. As of March 2010 monthly manufacturing capacity is 80,000 wafers.
Affiliate Company
Elpida's subsidiary Tera Probe is one of the largest pure-play semiconductor testing company in Japan. This subsidiary handles DRAM manufacturing front-end wafer probe testing on behalf of Elpida.
Affiliate Company
Elpida's subsidiary TeraPower Technology does semiconductor product wafer testing.
Business Partner
Powerchip Technology Corporation
Elpida both provides its technology to and outsources the manufacture of mainly DRAMs for PCs to Powerchip.
Business Partner
Elpida both provides its technology to and outsources the manufacture of mainly DRAMs for PCs to ProMOS.
Business Partner
Winbond Electronics Corporation
Elpida both provides its technology to and outsources the manufacture of mainly graphics DRAMs to Winbond.
Production Bases: Back-End Process
Affiliate Company
Akita Elpida handles the development, packaging and testing of advanced packages such as MCP* and PoP*. As of March 2010 Akita Elpida has a monthly production capacity of 15 million packages (single-die package equivalent).
*1 MCP or Multi Chip Package: The stacking together of multiple semiconductor chips within a surface-mount package.
*2 PoP or Package on Package: The stacking of multiple flat surface-mount packages (such as BGA or Ball Grid Array).
Business Partner
Elpida outsources its packaging and testing of mainly DRAMs for PC and server to Powertech Technology Inc. (Taiwan).
Business Partner
Walton Advanced Engineering, Inc.
Elpida outsources its packing and testing of mainly DRAMs for digital consumer electronics to Walton Advanced Engineering, Inc (Taiwan).
Sales Bases
Elpida has established sales offices in the US, Europe and Asia. Also, to shorten the distance between Elpida and its customers enabling quick, flexible technology support, Sunnyvale Office, part of Elpida Memory (USA) Inc. (U.S.), and Geneva-based System Technology Lab operated by Elpida Memory (Europe) Sàrl (Switzerland) provide circuit simulations.