| Year | Month | |
|---|---|---|
| 1999 | December | Established and registered (trade name at establishment: NEC Hitachi Memory, Inc.) |
| 2000 | April | Began development operations for DRAM products, using 0.11µm or lower process |
| May | Changed trade name to Elpida Memory, Inc. (announced in September 2000) | |
| 2001 | February | Began construction of 300mm wafer fabrication plant (hereafter, E300 Fab) |
| Started sales operations in domestic market | ||
| March | Started sales operations in foreign markets (North America, Europe, and Asia) | |
| 2002 | January | Elpida has been certified by BSI as being in full compliance with the requirements of the ISO9001:2000 Quality System. |
| 2003 | January | Completed trial manufacturing at E300 Fab and began production activities |
| March | Took on Mitsubishi Electric Corporation's DRAM operations and employed Mitsubishi development engineers | |
| Finalized DRAM purchasing contract with Powerchip Semiconductor Corporation of Taiwan (hereafter, PSC) | ||
| September | Established Hiroshima Elpida Memory, Inc. (hereafter, Hiroshima Elpida) as a subsidiary responsible for production | |
| 2004 | June | Began expansion of E300 Fab |
| November | Listed on the Tokyo Stock Exchange | |
| 2005 | July | Reached agreement with ADVANTEST CORPORATION, Kingston Technology Japan, LLC, and Powertech Technology Inc. (Taiwan) the joint creating of a new company, Tera Probe, Inc., to be located in Japan for DRAM wafer testing |
| October | Commenced mass production of 90nm DRAM chips on E300 Fab Area 2 | |
| 2006 | July | Established Akita Elpida Memory, Inc. (hereafter, Akita Elpida) to take on the development of advanced back-end technology processes and the manufacture of advanced packages |
| 2007 | January | Reached official agreement with PSC regarding a DRAM manufacturing joint company, Rexchip Electronics Corporation |
| April | Hiroshima Elpida of its 200mm wafer processing equipment to Cension Semiconductor Manufacturing Corporation | |
| May | The start of volume production in Area 3 of the E300 fab | |
| July | Mass production begins at Rexchip, a joint venture established with PSC | |
| 2008 | April | Hiroshima Elpida merged into Elpida |
| 2009 | March | Converted Rexchip and Tera Probe from equity-method affiliates into consolidated subsidiaries |
| August | Entered into the graphics DRAM business | |
| November | Entered into outsourcing agreements with ProMOS Technologies Inc. and Winbond Electronics Corporation | |
| 2010 | March | Established an R&D center inside Rexchip |
