Elpida Memory Delivers Industry's Highest Density DRAM Modules for Notebook and Mobile Computers

TOKYO, JAPAN, October 15, 2001 - Elpida Memory, Inc. (Elpida), the industry's only major semiconductor company to focus completely on DRAM, announced today the availability of its 512 MByte Small Outline (S.O.) Dual In-line Memory Modules (DIMMs) for notebook and mobile computing applications.

"Elpida's new 512 MByte S.O. DIMMs are currently the highest density S.O. DIMMs available," according to Yasu Yoshitomi, technical marketing manager for Elpida Memory (USA) Inc. "Notebook and mobile computers are rapidly replacing desktop computers in the home and work environments, and higher memory density for these computers is currently in great demand. Elpida's new modules enable notebook and mobile computers to have as much memory as desktop systems."

Elpida's 512 MByte S.O. DIMMs, measuring 67.6 mm (length) ( 31.75 mm (height) ( 3.8 mm (thickness), are fully compatible with the JEDEC industry standard specification for 8-Byte (x64) S.O. DIMMs. The S.O. DIMM form factor was first introduced in 1990 to allow notebook computers to save space while maximizing the amount of system memory. It is 63% smaller than the standard DIMM form factor used in desktop applications. Until now, the maximum memory density per S.O. DIMM was 256 Mbytes. Elpida's 512 MByte S.O. DIMMs feature a (64-bit configuration, 2 memory banks, 3.3 V power supply voltage, a low self-refresh current, PC133/PC100 compatibility, and a 144-pin zig zag dual tab with a lead pitch of 0.80 mm for dual lead-out sockets. They are unbuffered for PC applications. These modules are also supported by several chipsets designed specifically for notebook applications.

Device Packaging Doubles the DIMM Density
To double the density of these modules, Elpida uses its proven, stacked Tape Carrier Packaging (TCP) technology for each of the sixteen 256 Mbit (32 Mbit x 8 bit) Synchronous DRAM (SDRAM) devices that fit on each module. The memory bus clock frequency operates at 133 MHz (PC133) or 100 MHz (PC100) with a CAS latency (CL) of 3 or 2, respectively.

Availability

About Elpida Memory, Inc.
Elpida Memory, Inc. is a global corporation with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida's research, design and development operations were merged from NEC and Hitachi on April 1, 2000 and sales and marketing operations commenced in Q1, 2001. Elpida's entire DRAM semiconductor product line is now marketed under the Elpida brand name and includes DRAM devices and modules inherited from both NEC and Hitachi, as well as new products designed and developed by Elpida. Elpida's main DRAM foundries are located at NEC Hiroshima and Hitachi Nippon Steel Semiconductor Singapore. Elpida's own 300 mm DRAM wafer manufacturing facility is scheduled to begin production by January 2003.