Elpida Memory's 2 Gigabyte DDR SDRAM DIMMs Target High-Performance Server Applications
1.2-Inch-Height, Low-Profile, High-Density Modules Enable Maximum Memory Density
TOKYO, JAPAN, July 15, 2002 - Elpida Memory, Inc. (Elpida), announced today the availability of high-density 2 Gigabyte Registered DDR SDRAM DIMMs (Dual In-line Memory Modules) for high-performance server applications. The 512 Megabit DDR SDRAM-based DIMMs are designed with a 1.2-inch height to allow the maximum number of DIMM modules to be deployed in a space-limited 1U rack server.
This combination of ultrahigh density and low-profile configuration is achieved with Elpida's Tape Carrier Packaging (TCP) technology, which is used to stack and mount 36 pieces of DDR SDRAM on a single DIMM. This proprietary packaging technology offers improved thermal characteristics over conventional TSOP stacked modules, and enables a thinner module package (4.8 mm vs. 6.8mm). The DDR devices used on the modules are produced with Elpida's proven 0.13 micron process technology, and they support 2.5 Volt operation and Error Checking and Correction (ECC) needed for demanding server designs.
"Elpida Memory's advanced engineering capabilities continue to add value for our customers through enhanced implementations of industry standard technologies," said Jun Kitano, director of Technical Marketing for Elpida Memory (USA) Inc. "The ability to pack more memory performance into smaller spaces remains a key requirement for our customers, and Elpida is responding to their requirements with these new low-profile, thermal-efficient, high-density DIMM modules."
Availability
| Elpida Part Number | Description | Availability |
|---|---|---|
| EBD21RD4ABNA | 1.2inch, 184-pin DIMM 256M-Words x 72 bits, 2 Banks |
Samples: Immediate Volume: Q4 2002 |
About Elpida Memory, Inc.
Elpida Memory, Inc. is a technology leader in Dynamic Random Access Memory (DRAM) with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida offers a broad range of leading-edge DRAM products including RDRAM®, SDRAM, DDR SDRAM, Mobile RAM and Consumer SDRAM. Device densities currently range up to 512 Megabits each, and Module (DIMM) densities range up to 2 Gigabytes each. Elpida offers a variety of standard and high performance packaging techniques, including TSOP, BGA, FBGA, Tape Carrier Package (TCP), and Double Density Package (DDP). Elpida's research, design and development operations were merged from NEC and Hitachi on April 1, 2000 and sales and marketing operations commenced in Q1, 2001. Elpida's main DRAM foundries are located at NEC Hiroshima and Hitachi Nippon Steel Semiconductor Singapore. Elpida's own 300 mm DRAM wafer manufacturing facility is scheduled to begin production by January 2003.
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Information in this news release is current as of the timing of the release, but may be revised later without notice.