Elpida Memory's 1 Gigabyte DDR SDRAM DIMMs Target High-Performance PCs and Workstations

TOKYO, JAPAN, July 30, 2002 - Elpida Memory, Inc. (Elpida), announced today the availability of 1 Gigabyte unbuffered DDR SDRAM DIMMs (Dual In-line Memory Modules) for high-performance PC and workstation applications. The Gigabyte DIMMs use sixteen or eighteen high-density, 512 Megabit DDR SDRAM devices to achieve the highest memory density currently possible for unbuffered DIMMs.

"Although PCs and workstations contain a limited number of memory slots, there is still a growing need for higher memory density to improve system performance," said Jun Kitano, director of Technical Marketing for Elpida Memory (USA) Inc. "Elpida's DDR DIMMs combine high density and high performance in a JEDEC industry-standard product."

Unbuffered DIMMs Support PC2100

Elpida's 1 Gigabyte, unbuffered DDR DIMMs are available in x64-bit or x72-bit configurations with Error Correction Code (ECC) as an optional feature for enhanced memory reliability. PCs and workstations typically use unbuffered DIMMs, DIMMs without the extra PLL or Register chips, because they are cost-effective. The 512 Megabit DDR SDRAM devices mounted on the DIMMs are produced with Elpida's proven 0.13 micron process technology and encapsulated in JEDEC standard TSOP packaging. They support 2.5 Volt operation and transfer data at 266 Megabits per second with a programmable CAS latency of 2 or 2.5. The new DIMMs are fully compliant with the JEDEC PC2100 standard, supporting total data transfer rates of 2.1 Gigabytes per second using the DDR266A component, and Elpida plans to support PC2700 with a data transfer rate of 2.7 Gigabytes per second using the DDR333B standard component in the near future.

Availability

About Elpida Memory, Inc.
Elpida Memory, Inc. is a technology leader in Dynamic Random Access Memory (DRAM) with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida offers a broad range of leading-edge DRAM products including RDRAM®, SDRAM, DDR SDRAM, Mobile RAM and Consumer SDRAM. Device densities currently range up to 512 Megabits each, and Module (DIMM) densities range up to 2 Gigabytes each. Elpida offers a variety of standard and high performance packaging techniques, including TSOP, BGA, FBGA, Tape Carrier Package (TCP), and Double Density Package (DDP). Elpida's research, design and development operations were merged from NEC and Hitachi on April 1, 2000 and sales and marketing operations commenced in Q1, 2001. Elpida's main DRAM foundries are located at NEC Hiroshima and Hitachi Nippon Steel Semiconductor Singapore. Elpida's own 300 mm DRAM wafer manufacturing facility is scheduled to begin production by January 2003.

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