Elpida Memory's 1 Gigabyte DDR SDRAM Small Outline DIMMs Target Mobile Applications
Tape Carrier Packaging Enables Maximum Density and Meets JEDEC Standard Thickness for Small Outline DIMMs
TOKYO, JAPAN, September 30, 2002 - Elpida Memory, Inc. (Elpida) announced today the availability of the industry's highest density Small Outline Dual In-line Memory Modules (SO DIMMs) using Double Data Rate (DDR) SDRAM technology. The 1 Gigabyte SO-DIMMs each incorporate sixteen 512 Megabit DDR devices using Elpida's proven, proprietary Tape Carrier Packaging (TCP) technology. The high-performance, high-density SO DIMMs are ideal for notebook computers and other mobile applications.
"Mobile applications such as notebook PCs can benefit from the advanced thermal and size improvements achieved with Elpida's DDR SDRAM SO DIMMS," said Jun Kitano, director of Technical Marketing for Elpida Memory (USA), Inc. "When designing space-limited applications, heat dissipation is a primary concern. By utilizing TCP and device stacking, we can achieve JEDEC standard thickness to allow increased air flow and meet our customer's demands for better thermal efficiency."
The 512 Megabit DDR SDRAM devices stacked on the SO DIMMs are designed using Elpida's proven 0.13 micron process technology. The TCP-packaged devices provide enhanced thermal characteristics along with the maximum memory density achievable on a JEDEC standard 200-pin SO DIMM form factor (31.75mm height, 3.8mm thickness) - an accomplishment only achievable with Elpida's TCP technology. Elpida's DDR SO DIMMs have a standard, 2.5 V power supply, and feature an SSTL interface. Elpida also plans to support PC2700 (DDR333) with 1 Gigabyte SO DIMMs to meet increased system performance requirements for mobile applications.
Availability
| Elpida Part Number | Description | Availability |
|---|---|---|
| EBD11UD8ABDA-7A/7B | 1 Gigabyte SO DIMM; 128M words x 64 bits; 2 Banks (using DDR SDRAM) |
Samples: Now Volume: Q1 2003 |
About Elpida Memory, Inc.
Elpida Memory, Inc. is a technology leader in Dynamic Random Access Memory (DRAM) with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida offers a broad range of leading-edge DRAM products including RDRAM®, SDRAM, DDR SDRAM, Mobile RAM and Consumer SDRAM. Device densities currently range up to 512 Megabits each, and Module (DIMM) densities range up to 2 Gigabytes each. Elpida offers a variety of standard and high performance packaging techniques, including TSOP, BGA, FBGA, Tape Carrier Package (TCP), and Double Density Package (DDP). Elpida's research, design and development operations were merged from NEC and Hitachi on April 1, 2000 and sales and marketing operations commenced in Q1, 2001. Elpida's main DRAM foundries are located at NEC Hiroshima and Hitachi Nippon Steel Semiconductor Singapore. Elpida's own 300 mm DRAM wafer manufacturing facility is scheduled to begin production by January 2003.
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Information in this news release is current as of the timing of the release, but may be revised later without notice.