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TOKYO/TAIPEI, May 6, 2003- Elpida Memory Inc. (Elpida) and ProMOS Technologies Inc. today announced that they have signed a Memorandum of Understanding (MOU) regarding the technology transfer and joint development of next-generation Dynamic Random Access Memory (DRAM) processes. The cooperation is intended for the design of all new processes starting with 0.10 micron and lower, including all new DRAM products. The agreement will also include arrangements for product purchase and supply, as well as the collaboration on new product development to better address market demand for new types of DRAM.
Elpida is the leading DRAM maker in Japan and is recognized worldwide for its advanced process technology. ProMOS has established its technology capability as well as its manufacturing competence and owns the capacity to deliver advanced, high-quality products to market quickly. This combination of strengths will serve as the foundation of a winning team.
"ProMOS offers excellent technology capability and manufacturing competence," said Yukio Sakamoto, president of Elpida Memory. "This partnership will further increase Elpida's DRAM capacity, allowing us to deliver advanced, high-quality products to the market quickly."
"Elpida is the leading DRAM maker in Japan and is recognized worldwide for its advanced process technology," said Hung-chiu Hu, the chairman of ProMOS. "This alliance indicates a new era for the global semiconductor market and initiates a new stage of continued growth."
Details of the agreement are currently under discussion by the parties and are expected to be finalized by Q3, 2003.
About Elpida Memory, Inc.
Elpida Memory, Inc. is a technology leader in Dynamic Random Access Memory (DRAM) with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida offers a broad range of leading-edge DRAM products including RDRAM®, SDRAM, DDR SDRAM, Mobile RAM and Consumer SDRAM. Device densities currently range up to 512 Megabits each, and Module (DIMM) densities range up to 2 Gigabytes each. Elpida offers a variety of standard and high performance packaging techniques, including TSOP, BGA, FBGA, Tape Carrier Package (TCP), and Double Density Package (DDP). Elpida's research, design and development operations began as a joint venture between NEC and Hitachi on April 1, 2000, and sales and marketing operations commenced in Q1, 2001.
About ProMOS Technologies Inc.
ProMOS Technologies is located at Hsinchu Science Park of Taiwan. It manufactures high-performance and high-capacity standard DRAMs and other niche products, including pseudo-SRAM and low power SDRAM. ProMOS possesses the most-advanced technologies among its DRAM peers and is noted in global DRAM industry for its outstanding technologies in process. ProMOS owns two fabrication plants (fabs). The 8 inch (200 mm) fab features 0.14 µm process while its 0.12µm/ 0.11µm process commenced production in Feb. 2002. Its 12 inch (300 mm) fab is among the first batch in the world to cross the threshold to volume production of DRAM. Worldwide Website www.promos.com.tw
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