- December 20, 2004
- Elpida Ships Fully-Buffered DIMM Samples for Advanced Performance in Next-Generation Servers
Memory Modules Provide Unparalleled Speed and Density Compared to Existing Registered DIMMs - December 17, 2004
- Elpida Memory Develops Distortion Control Technology to Improve Mass Production of Highly-Reliable DRAM
Results Based on Large-Scale Improvements in Data Retention Properties Presented at International Electron Devices Meeting - December 1, 2004
- Elpida Memory Develops 90 nm Silicon Wafer Process for High-Performance DDR2 SDRAM
Advanced Process Technology Boosts Production Efficiency for Superior DDR2 Products - November 25, 2004
- Hiroshima Elpida Selects New President
- Elpida Memory Announces Executive Personnel Change
- November 18, 2004
- Elpida Memory Develops First 1 Gigabit DDR2 SDRAM Device at 800 Mbps Operation
Working Silicon Achieves Maximum Speed Performance Targeting High-End Servers - November 15, 2004
- Elpida Memory Lists Initial Public Offering on Tokyo Stock Exchange
- August 2, 2004
- Elpida Memory Offers Mass Production of 512 Megabit Mobile RAM Devices that Deliver Improved Power Consumption to Cellular Products
New Devices Combine Two 256 Megabit Mobile RAM Devices in a Multi-Chip Package - July 27, 2004
- Elpida Memory Begins Mass Production of DDR2 SDRAM Using 0.10-micron Process Technology
- July 21, 2004
- Elpida Memory's Expanded Line of 128 Megabit DDR SDRAM Devices Provide High Bandwidth for Digital Consumer Applications
0.11 micron, x16, DDR400 Devices are Ideal for Standard and High Definition TV - July 20, 2004
- New CAM for IPv6 generation Network Routers
Enabling six times more IP address storage than before - June 28, 2004
- Elpida Memory Develops Two New High-Speed DRAM Technologies Designed to Increase IT Infrastructure Performance
DRAM Speed as Fast as SRAM and DDR1/DDR2 SDRAM Produced on a Single 1 Gigabit Chip - June 16, 2004
- Elpida Memory and Micron Japan File Petition Against Hynix Semiconductor
Petition Includes Japan Countervailing Duties for All DRAMs and DRAM Modules Manufactured by Hynix in the Republic of Korea - June 10, 2004
- Elpida Memory Expands Semiconductor Production Facilities
Construction Begins on Second 300 mm Fabrication Plant and First 300 mm Fab Set to Boost Mass Production - May 19, 2004
- Elpida's 0.11-micron Digital Consumer DRAM Devices Meet the Memory Demands of New DRAM Applications
Densities Range from 64 Megabit to 256 Megabit with Wide x16 and x32-bit Organizations and Multiple Packaging Options - April 1, 2004
- Hiroshima Elpida Signs Agreement to Acquire NEC Hiroshima Assets
Purchase Procures Land, Buildings and Silicon Wafer Production Facilities for DRAM Business Efficiency and Growth - March 4, 2004
- Hiroshima Elpida Selects New President
Elpida Memory's Yukio Sakamoto to Head Semiconductor Manufacturing Subsidiary - February 18, 2004
- Elpida Memory to Speak at Intel's Memory Implementers Forum Roundtable Event
As a Charter Member of the "Memory Implementers Forum" Elpida Will Participate in Discussions on DDR2 and Fully Buffered Dual In-Line Memory Modules - February 16, 2004
- Elpida Memory's 1 Gigabyte DDR2 Small Outline-DIMM Provides Unprecedented Memory Speed, High Density and Low Power to Notebook Applications
256 Megabit DDR2 Devices Complement Elpida's DDR2 Device and Module Line-up - January 13, 2004
- Elpida Memory's 2 Gigabyte DDR2 Registered DIMMs Deliver High-Density, High-Speed Performance to Server Market -Modules Ready for Volume Production
Unique sBGA Stacking Technology Achieves Slim and Reliable Module with Enhanced Thermal Performance - January 7, 2004
- Elpida Memory's 64 Megabit SDR Mobile RAM Devices Bring Improved Power Consumption and Increased Bandwidth to Cellular Applications
New Devices Utilize Edge Pads for Easier Implementation into Multi-Chip Package Designs
