Elpida Memory Sets Price for #1 and #2 Unsecured Straight Bonds with Inter-Bond Pari Passu Clause
TOKYO, JAPAN, March 8, 2005 - Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has set the price for #1 and #2 unsecured straight bonds with inter-bond pari passu clause as stated below.
Elpida has increased the total offering size to JPY 70 billion from JPY40 billion, given the strong demand which exceeds the initial offering size.
Description of Bonds
- Elpida Memory, Inc. #1 Unsecured Straight Bonds (with inter-bond pari passu clause)
- Issue Size: JPY 55 billion
- Denomination: JPY 100 million
- Interest Rate: 1.45% per annum
- Issue price: JPY100 per face value JPY 100
- Duration: 5 years
- Maturity Date: March 19, 2010
- Interest Payment Date: March 22, and September 22 each year
- Payment Date: March 22, 2005
- Underwriters: Daiwa Securities SMBC Co. Ltd.; Deutsche Securities Limited, Tokyo Branch (joint lead managers and joint bookrunners), and other co-managers
- Fiscal Agent: Sumitomo Mitsui Banking Corporation
- Rating: BBB+ (Japan Credit Rating Agency, Ltd.)
- Use of Proceeds: Repayment of loans and lease obligations
- Elpida Memory, Inc. #2 Unsecured Straight Bonds (with inter-bond pari passu clause)
- Issue Size: JPY 15 billion
- Denomination: JPY 100 million
- Interest Rate: 2.03% per year
- Issue price: JPY100 per face value JPY100
- Duration: 7 years
- Maturity Date: March 22, 2012
- Interest Payment Date: March 22, and September 22 each year
- Payment Date: March 22, 2005
- Underwriters: Daiwa Securities SMBC Co. Ltd.; Deutsche Securities Limited, Tokyo Branch (joint lead managers and joint bookrunners)
- Fiscal Agent: Sumitomo Mitsui Banking Corporation
- Rating: BBB+ (Japan Credit Rating Agency, Ltd.)
- Use of Proceeds: Repayment of loans and lease obligations
About Elpida Memory, Inc.
Elpida Memory, Inc. is a manufacturer of Dynamic Random Access Memory (DRAM) silicon chips with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida's state-of-the-art semiconductor wafer manufacturing facilities are located in Hiroshima, Japan. Elpida offers a broad range of leading-edge DRAM products for high-end servers, mobile phones, digital television sets and digital cameras as well as personal computers. Elpida had sales of ¥100.4 billion during the fiscal year ending March 31, 2004.
This is a press release document intended for publicizing the issuance of the corporate bonds and is not intended for solicitation of the bonds. For potential investment in the bonds, please carefully read the securities registration statement (available only in Japanese) prepared by Elpida and make your own investment judgment.
Information in this news release is current as of the timing of the release, but may be revised later without notice.