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Elpida Memory Sets Price for #3 and #4 Unsecured Straight Bonds with Inter-Bond Pari Passu Clause

TOKYO, JAPAN, November 25, 2005 - Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has set the price for #3 and #4 unsecured straight bonds with inter-bond pari passu clause based on the domestic straight bond shelf registration (registered amount: JPY100 billion, effective period: through October 19, 2007) as stated below.

Elpida plans to use the proceeds of the issuance for the repayment of loan and lease obligations which will become due during the fiscal year ending March 31, 2007.

Description of Bonds

About Elpida Memory, Inc.
Elpida Memory, Inc. is a manufacturer of Dynamic Random Access Memory (DRAM) silicon chips with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida's state-of-the-art semiconductor wafer manufacturing facilities are located in Hiroshima, Japan. Elpida offers a broad range of leading-edge DRAM products for high-end servers, mobile phones, digital television sets and digital cameras as well as personal computers. Elpida had sales of ¥207.0 billion during the fiscal year ending March 31, 2005.

This is a press release document intended for publicizing the issuance of the corporate bonds and is not intended for solicitation of the bonds. For potential investment in the bonds, please carefully read the prospectus (available only in Japanese) prepared by Elpida and make your own investment judgment.

Information in this news release is current as of the timing of the release, but may be revised later without notice.


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