Hiroshima Elpida Commences Mass Production of 90 nm DRAM Chips on New 300 mm Wafer Production Line <attachment>
Overview of Hiroshima Elpida Memory 300 mm Wafer Line
| Construction site: | Hiroshima Elpida Memory, Inc. (on existing company grounds) |
| Start of construction of expanded line: | June 2004 |
| Completion of construction of expanded line (building): | June 2005 |
| Start of mass production following line expansion: | October 2005 |
| Processing capacity: | 45,000 wafers/month (Nov. 2005), 54,000 wafers/month (planned as of FY 2005 4Q) |
| Company placing construction order: | Hiroshima Elpida Memory, Inc. |
| Designer & builder: | Obayashi Corporation |
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Information in this news release is current as of the timing of the release, but may be revised later without notice.