Elpida Memory Issues 5th Unsecured Straight Bonds
TOKYO, JAPAN, January 17, 2007 – Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has determined the terms of the 5th unsecured straight bonds (with inter-bond pari passu clause) based on the domestic straight bond shelf registration (registered amount: JPY100 billion, effective period: through October 19, 2007) as stated below.
Elpida plans to use the proceeds of the issuance for the repayment of loan and lease obligations which will become due by March 31, 2008.
Description of Bonds
- Elpida Memory, Inc. 5th Unsecured Straight Bonds (with inter-bond pari passu clause)
- Issue Size: JPY 30 billion
- Denomination: JPY 100 million
- Interest Rate: 2.09% per annum
- Issue price: JPY100 per face value JPY 100
- Duration: 5 years
- Maturity Date: January 24, 2012
- Interest Payment Date: January 24, and July 24 each year
- Payment Date: January 24, 2007
- Underwriters: Mizuho Securities Co., Ltd.(lead manager and book runner)
- Fiscal Agent: Mizuho Corporate Bank, Ltd.
- Rating: BBB+ (Japan Credit Rating Agency, Ltd.)
- Use of Proceeds: Repayment of loans and lease obligations
About Elpida Memory, Inc.
Elpida Memory, Inc. is a manufacturer of Dynamic Random Access Memory (DRAM) silicon chips with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida's state-of-the-art semiconductor wafer manufacturing facilities are located in Hiroshima, Japan. Elpida offers a broad range of leading-edge DRAM products for high-end servers, mobile phones, digital television sets and digital cameras as well as personal computers.
This is a press release document intended for publicizing the issuance of the corporate bonds and is not intended for solicitation of the bonds.