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Elpida Memory Issues 6th Unsecured Straight Bonds

TOKYO, JAPAN, November 22, 2007 – Elpida Memory, Inc. (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has determined the terms of the 6th unsecured straight bonds (with inter-bond pari passu clause) based on the domestic straight bond shelf registration (registered amount: JPY150 billion, effective period: through October 26, 2009) as stated below.

Description of Bonds

Elpida Memory, Inc. 6th Unsecured Straight Bonds (with inter-bond pari passu clause)

About Elpida Memory, Inc.
Elpida Memory, Inc., (Tokyo Stock Exchange: Code 6665), is a leading global manufacturer of Dynamic Random Access Memory (DRAM) silicon chips. Our design, manufacturing, and sales operations are backed by our world-class technology expertise. Our manufacturing facilities, Hiroshima Elpida Memory, Inc. (wafer processing) and Akita Elpida Memory, Inc. (packaging and testing), utilize the most advanced manufacturing technologies available in the industry. Elpida's portfolio of advanced products features such characteristics as high-density, high-speed, low power and small packing profiles. The company provides applications across a wide range of areas, including high-end servers, mobile phones and digital consumer electronics. For more information about Elpida, please visit http://www.elpida.com.

This is a press release document intended for publicizing the issuance of the corporate bonds and is not intended for solicitation of the bonds.


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