- December 27, 2007
- Elpida Memory Announces Executive Personnel Changes
(PDF: 20KB)
- December 5, 2007
- Elpida Memory Announces Executive Personnel Changes
(PDF: 20KB)
- November 22, 2007
- Elpida Memory Issues 6th Unsecured Straight Bonds
(PDF: 23KB)
- November 7, 2007
- Elpida Develops a 65nm-Process 1-Gigabit DDR2 SDRAM, the World's Smallest Chip
Mass Production to Begin in 1Q 2008
(PDF: 23KB)
- October 30, 2007
- Elpida Develops World's First Ultra-Low Voltage (1.2V) 533Mbps DDR2 Mobile RAM
512-Megabits and JEDEC DDR2 Compliant
(PDF: 30KB)
- October 24, 2007
- 2Q FY2007 financial release
- October 22, 2007
- Elpida and UMC Announce Joint Development Program: Copper Low-k DRAM and PRAM Technologies
(PDF: 16KB)
- October 19, 2007
- Elpida Memory Reports Preliminary Financial Results for the 1H of FY2007
(PDF: 33KB)
- October 12, 2007
- Rexchip Grand Opening Ceremony
(PDF: 23KB)
- October 4, 2007
- Elpida Introduces the World's Fastest DRAM Based on the Rambus XDR Memory Architecture
4.8GHz XDR DRAM achieves 6x performance increase over industry-standard DDR2 DRAMs
(PDF: 47KB)
- September 26, 2007
- Elpida Announces Remaining Terms of Stock Options Plan
(PDF: 29KB)
- September 25, 2007
- Elpida Memory Achieves World's First 1066Mbps 2-Gigabit DDR2 SDRAM
30% Faster Than Existing DRAMs and Consumes 20% Less Power
(PDF: 23KB)
- August 30, 2007
- Change to Recent News Release Entitled "Final Agreement Reached on the Sale of Hiroshima Elpida's 200mm Wafer Processing Equipment"
(PDF: 65KB)
- Elpida Announces Terms of Stock Option Plan
(PDF: 70KB)
- July 25, 2007
- 1Q FY2007 financial release
- Notice about merger of a consolidated subsidiary
(PDF: 25KB)
- May 22, 2007
- Notice Concerning a Change in Corporate Officers
(PDF: 19KB)
- May 17, 2007
- Elpida Memory Announces Auditors Appointments
(PDF: 20KB)
- May 15, 2007
- Elpida Memory Announces Executive Personnel Changes
(PDF: 19KB)
- May 14, 2007
- Elpida's DDR3 Memory Receives Intel's Validation with Reference Platform of G33 Chipset
DDR3 Memory Platform Start-Ups Are Fully Supported
(PDF: 26KB)
- April 24, 2007
- FY2006 financial release
- April 23, 2007
- Akita Elpida Memory Successfully Develops World's Thinnest 1.4 mm MCP with 20 Stacked Dies
(PDF: 42KB)
- April 10, 2007
- Elpida Memory Reports Preliminary Financial Results for FY2006
(PDF: 27KB)
- Final Agreement Reached on the Sale of Hiroshima Elpida's 200mm Wafer Processing Equipment
(PDF: 14KB)
- March 30, 2007
- Elpida Memory Establishes JPY 160 Billion in Financing Options; JPY 110 Billion Long-term Loan for Capital Expenditures
(PDF: 22KB)
- March 14, 2007
- Elpida joins IMEC's CMOS research platform
(PDF: 64KB)
- February 26, 2007
- Elpida Memory Announces Executive Personnel Change
(PDF: 19KB)
- February 19, 2007
- Basic Agreement Concerning the Sale of Hiroshima Elpida's 200mm Wafer Processing Equipment
(PDF: 14KB)
- January 25, 2007
- 3Q FY2006 financial release
- Elpida and PSC Finalize Taiwan-based "Rexchip" DRAM Joint Venture Agreement
(PDF: 14KB)
- January 17, 2007
- Elpida Memory Issues 5th Unsecured Straight Bonds
(PDF: 16KB)
