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Elpida Announces Remaining Terms of Stock Options Plan

TOKYO, JAPAN, September 24, 2008 – Elpida Memory, Inc. (the Company), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the pricing terms of a Stock Options plan that was decided at a Board of Directors meeting held on August 26, 2008, which acted pursuant to the resolution of a General Shareholders' Meeting held on June 24, 2008.

The terms of issuance of Stock Options are as follows:

1. Number of and categories of persons to whom the Stock Options are allocated: Total of 513 directors, officers or employees of the Company or a subsidiary of the Company
2. Class and number of shares to be acquired upon exercise of the Stock Options: 100,000 common shares
3. Number of Stock Options to be issued: 1,000 units (100 shares per unit)
4. Issue price of the Stock Options: To be issued gratis
5. Exercise price of the Stock Options: 2928 yen per share
6. Amount of capital and additional paid-in capital to be increased through the exercise of the Stock Options: Capital
- 1464 yen per share
Additional paid-in capital
- 1464 yen per share
7. Scheduled allotment date of Stock Options: September 24, 2008

Notes:

  1. Date the Board of Directors decided that the stock option plan to be submitted to the general shareholders' meeting for approval:
       May 22, 2008
  2. Date of approval of the Stock Option plan at the general shareholders meeting:
       June 24, 2008
  3. Date the Board of Directors decided to the terms of the issuance of stock options:
       August 26, 2008

About Elpida
Elpida Memory, Inc. (Tokyo: 6665) is a leading manufacturer of Dynamic Random Access Memory (DRAM) integrated circuits. The company's design, manufacturing and sales operations are backed by world class technological expertise. Its 300mm manufacturing facilities, consisting of its Hiroshima Plant and a Taiwan-based joint venture, Rexchip Electronics, utilize the most advanced manufacturing technologies available. Elpida's portfolio features such characteristics as high-density, high-speed, low power and small packaging profiles. The company provides DRAM solutions across a wide range of applications, including high-end servers, mobile phones and digital consumer electronics. More information can be found at http://www.elpida.com.

Information in this news release is current as of the timing of the release, but may be revised later without notice.


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