Elpida Receives "2009 Global Warming Prevention Activity Award" from
Japan's Ministry of the Environment
TOKYO, JAPAN, December 2, 2009 – Elpida Memory, Inc. (TOKYO: 6665), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that its primary chip manufacturing fab, the Hiroshima Plant, was named one of the recipients of the "2009 Global Warming Prevention Activity Award" bestowed by Japan's Ministry of the Environment.
The award has been given annually since 1998 in recognition of individuals and organizations in Japan that have made outstanding contributions to the prevention of global warming.
Elpida's Hiroshima Plant has made it a top priority to institute environmental measures that can reduce the production of greenhouse gas emissions that cause global warming. The plant uses Japan's largest-scale cogeneration system to reduce CO2 emissions and has installed PFC combustion abatement systems to reduce greenhouse gas emissions. Also, since 2003 the plant has introduced an extensive range of energy conservation measures and plant employees have gone through environmental awareness training. As a result of these efforts the Hiroshima Plant has cut annual CO2-equivalent emissions by 862 kilotons (a 56% reduction). The Environment Ministry's 2009 award honors this accomplishment by recognizing the plant's "facility-wide activities to lessen greenhouse gas emissions."
The Elpida Group intends to promote greater environmental awareness among its employees and to implement additional "green" measures in its semiconductor manufacturing facilities.
Elpida Memory, Inc. (Tokyo: 6665) is a leading manufacturer of Dynamic Random Access Memory (DRAM) integrated circuits. The company's design, manufacturing and sales operations are backed by world class technological expertise. Its 300mm manufacturing facilities, consisting of its Hiroshima Plant and a Taiwan-based joint venture, Rexchip Electronics, utilize the most advanced manufacturing technologies available. Elpida's portfolio features such characteristics as high-density, high-speed, low power and small packaging profiles. The company provides DRAM solutions across a wide range of applications, including high-end servers, mobile phones and digital consumer electronics. More information can be found at http://www.elpida.com.
Information in this news release is current as of the timing of the release, but may be revised later without notice.