Houli Science Park's receipt of infrastructural and other kinds of support from Taiwan's central government enabled Rexchip to achieve a fast start-up. Construction of Rexchip's R1 Fab was completed in February 2007 and mass manufacturing began in July that same year. By December production capacity was greater than 40,000 wafers and reached 75,000 wafers by March 2008, well above the goal of 60,000 wafers for this time. The expansion of manufacturing capacity over this short time period along with high productivity and the achievement of desired yields allowed Rexchip to quickly reduce costs.

On March 16, 2009 Elpida acquired enough Rexchip shares from PSC and PSC affiliates to boost its equity interest in Rexchip from 48.8% to 52.0%. The purpose of this acquisition was to accelerate management decision-making at Rexchip and to adjust the allotment of manufacturing in a way that optimizes the balance of supply and demand within each category of customers. As a result, Rexchip has become an Elpida consolidated subsidiary.
As of March 2009 Rexchip's R1 Fab is using 65nm process technology to manufacture PC DRAMs based on the industry-leading 1-gigabit DDR2 standard. Rexchip will continue to play an important role in supporting Elpida's PC DRAM and, along with the Hiroshima Plant, will continue to develop more advanced manufacturing capabilities.

Layout of Rexchip fabs

