Elpida Receives Outstanding Supplier Award from
Kingston Technology
TOKYO, JAPAN, August 31, 2009 – Elpida Memory, Inc. (Head Office: Chuo-ku Tokyo, Representative: Yukio Sakamoto, President & CEO, hereinafter referred to as "Elpida"), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), has been presented with an Outstanding Supplier Award by Kingston Technology Company, Inc. (Head Office: Fountain Valley, California David Sun, Executive, hereinafter referred to as "Kingston").
The award was given in recognition of Elpida's outstanding performance in quality, flexibility, and service, and for demonstrating supplier excellence with four consecutive first places among the DRAM suppliers in Kingston's DRAM rating system.
"We are very honored to receive this Outstanding Supplier Award from Kingston", said Yasushi Takahashi, Executive Officer of Elpida's Server & PC Division. "Elpida has been supplying Kingston with cutting-edge DRAM for their memory-module for many years, and we have developed a strong relationship built on cooperation and trust. We will continue to supply Kingston and our other customers with the best DRAM solutions by fine-tuning our DRAM technologies and customer support services so as to maintain our position as a top supplier."
About Elpida
Elpida Memory, Inc. (Tokyo: 6665) is a leading manufacturer of Dynamic Random Access Memory (DRAM) integrated circuits. The company's design, manufacturing and sales operations are backed by world class technological expertise. Its 300mm manufacturing facilities, consisting of its Hiroshima Plant and a Taiwan-based joint venture, Rexchip Electronics, utilize the most advanced manufacturing technologies available. Elpida's portfolio features such characteristics as high-density, high-speed, low power and small packaging profiles. The company provides DRAM solutions across a wide range of applications, including high-end servers, mobile phones and digital consumer electronics. More information can be found at http://www.elpida.com.
Information in this news release is current as of the timing of the release, but may be revised later without notice.